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6 senior acquisition program management professional jobs found

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Electronics senior acquisition program management professional Florida
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Lockheed Martin
Apr 16, 2026
Hardware IPT Lead
Lockheed Martin Orlando, FL
Description: You will be the Hardware IPT Lead for the TacIRST CLASS system within the ATWS NBAE program. Our team delivers the high performance infrared search and track hardware that powers Lockheed Martin’s missile and fire control portfolio. You’ll lead a cross functional group of precision mechanical designers, electrical engineers, structural and thermal analysts, electromechanical designers, and components and materials specialists to bring the system from concept to production ready hardware. What You Will Be Doing As the IPT Lead you will own the end to end hardware design effort, tracking progress across all disciplines, aligning processor builds with the program schedule, and guiding the transition to a production engineering team that optimizes high rate manufacturing. You will collaborate closely with other engineering domains and program stakeholders to ensure the hardware meets performance, reliability, and cost targets. Your responsibilities will include: •...
Lockheed Martin
Apr 16, 2026
ASIC & FPGA Design Engineer Senior
Lockheed Martin Orlando, FL
Description: You will be the Senior ASIC & FPGA Design Engineer for the ADSWAP CN program. Our team builds the next generation missile and fire control systems that power aerospace and defense grade platforms. We turn ambitious system concepts into hardened hardware, partnering with software, hardware, and systems engineers to deliver integrated, high performance solutions. What You Will Be Doing As the Senior ASIC & FPGA Design Engineer you will lead the end to end creation of sophisticated FPGA architectures—from initial concept through detailed implementation and verification. You will define specifications, run trade off studies, and ensure every design meets rigorous power, thermal, and utilization targets while staying aligned with Design Assurance standards. Your responsibilities will include: • Develop complete FPGA design specifications and high level architecture in collaboration with cross functional teams. • Select the optimal FPGA family (Xilinx, Intel,...
Lockheed Martin
Apr 08, 2026
Electrical Engineering Senior - ARRW LRIP
Lockheed Martin Orlando, FL
Description: You will be the Electrical Engineering Senior for the Air Launched Rapid Response Weapon (ARRW) Low Rate Initial Production (LRIP) team. Our team drives reliability across production, troubleshoots hardware issues, and partners with suppliers to guarantee that every circuit delivers mission critical performance. What You Will Be Doing As the senior electrical engineer you will serve as the technical liaison for the ARRW Vehicle Management Computer (VMC). You’ll thrive in a fast paced production environment, delivering rapid, accurate solutions while collaborating with engineering, test, and manufacturing groups. Travel averages 50 % of your time for a 12 month stint in Los Angeles, CA, giving you exposure to both field and office settings. Your responsibilities will include: • Acting as the primary point of contact for VMC hardware across the LRIP effort. • Performing electrical testing, firmware/FPGA verification, and electro mechanical packaging reviews to keep...
Lockheed Martin
Mar 17, 2026
Programmable Logic and ASIC Design Center of Excellence Lead
Lockheed Martin Orlando, FL
Description: You will be the Programmable Logic & ASIC Center of Excellence (CoE) Lead for the Missiles & Fire Control (MFC) organization. Our CoE provides end to end hardware development for programmable logic devices, custom ASICs and system on chip solutions, delivering unified, reusable flows and metrics that support multiple MFC programs. What You Will Be Doing As the PL/ASIC CoE Lead you will set the strategic and technical direction for PL and ASIC development, define the CoE charter and roadmap, align scope with senior leadership, and own tool/flow automation and continuous integration gates. You will drive common core digital and verification standards, ensure consistency across tools and processes, and mentor talent while contributing expertise to MFC programs. Your responsibilities will include: • Defining, maintaining and regularly updating the CoE charter, roadmap and multi year improvement plan. • Chairing CoE meetings, hosting quarterly steering...
Lockheed Martin
Mar 12, 2026
ASIC & FPGA Design Engineer Senior
Lockheed Martin Orlando, FL
Description: You will be the Senior ASIC & FPGA Design Engineer for the Laser Weapon System (LWS) Turret Closing team. Our team is responsible for delivering high performance, low latency FPGA based closed loop motor control solutions that enable rapid, precise turret positioning for next generation directed energy weapons. What You Will Be Doing As the Senior ASIC & FPGA Design Engineer you will lead the end to end development of the FPGA motor control hardware, translating system level performance, safety and reliability requirements into a robust architecture, driving verification, hardware in the loop testing and integration, and shepherding the design from concept through production release. Your responsibilities will include: • Capturing and translating system level performance, safety and reliability requirements into a detailed FPGA architecture. • Developing and verifying RTL using SystemVerilog/Verilog and Xilinx/AMD toolsets, creating synthesis, timing and...
Lockheed Martin
Feb 12, 2026
ElectroMechanical Design Engineer Sr: MicroElectronics
Lockheed Martin Orlando, FL
Description: You will be the ElectroMechanical Design Engineer for the Advanced Electronics Packaging team at Lockheed Martin Missiles & Fire Control. Our team pioneers 2 D/3 D heterogeneous packaging concepts, integrating thin film, semiconductor and high performance thermal management technologies to create next generation electronic systems for aerospace and defense missions. What You Will Be Doing As the ElectroMechanical Design Engineer you will design, prototype and test cutting edge packaging solutions while collaborating with electrical, systems, test and product design engineers. You will work side by side with Lockheed Martin’s senior Advanced Packaging SME, gaining hands on experience with emerging semiconductor manufacturing processes and translating them into flight qualified hardware. Your responsibilities will include: • Conceiving and modeling 2 D/3 D heterogeneous package architectures that meet size, weight, power and reliability targets. • Developing...
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