Lockheed Martin
Orlando, FL
Description: You will be the Circuit Card Design Engineer – Microelectronics Packaging for Lockheed Martin’s Missiles & Fire Control division. Our team drives the definition, development, and validation of next generation microelectronics processes, tool flows, and design methodologies for multichip packages. By advancing organic, silicon, active silicon, embedded passive, and miniature inductor substrates, you help deliver the size weight power cost (SWAP C) reductions that keep our missile and fire control systems at the cutting edge. What You Will Be Doing As the Circuit Card Design Engineer you will translate high performance circuit card expertise into emerging substrate technologies, create detailed single BGA package designs, and build verification plans that meet stringent Design Assurance standards. You will partner with materials, mechanical, manufacturing, and test groups to ensure packaging solutions flow smoothly from concept to production. Your...