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Lockheed Martin
Mar 12, 2026
Dispatcher/Firefighter/EMT
Lockheed Martin Stratford, CT, USA
Description: The Firefighter Dispatcher is the telecommunicator for SAC, as the fire department is the primary answering point for the 1-911 system. The Firefighter Dispatcher alerts all fire fighters on duty by activating tone/voice radio/intercom transmission, with details of the emergency type and location. Monitor multiple radios and fire alarm system simultaneously. Duties include but are not limited to: structural and aircraft rescue firefighting, hazardous material response, confined space rescue, entering IDLH atmospheres, providing emergency medical treatment, participate in fire prevention programs, continuous improvement processes, complete written inspection reports, fire extinguisher inspections, testing and minor maintenance of fire alarms and related equipment, inspecting, testing, and operating fire department vehicles and rescue boats, receive and dispatch alarms, routine station cleaning assignments, and other duties as assigned. Basic Qualifications:...
Lockheed Martin
Feb 12, 2026
ElectroMechanical Design Engineer Sr: MicroElectronics
Lockheed Martin Orlando, FL, USA
Description: You will be the ElectroMechanical Design Engineer for the Advanced Electronics Packaging team at Lockheed Martin Missiles & Fire Control. Our team pioneers 2 D/3 D heterogeneous packaging concepts, integrating thin film, semiconductor and high performance thermal management technologies to create next generation electronic systems for aerospace and defense missions. What You Will Be Doing As the ElectroMechanical Design Engineer you will design, prototype and test cutting edge packaging solutions while collaborating with electrical, systems, test and product design engineers. You will work side by side with Lockheed Martin’s senior Advanced Packaging SME, gaining hands on experience with emerging semiconductor manufacturing processes and translating them into flight qualified hardware. Your responsibilities will include: • Conceiving and modeling 2 D/3 D heterogeneous package architectures that meet size, weight, power and reliability targets. • Developing...
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