3 systems engineering lead jobs found

Description: You will be the Packaging & Shipping Engineer for the Program Integration & Packaging Team at LMCO MFC Dallas. Our team drives the end to end packaging strategy for aircraft programs, ensuring every component— from sub systems to hazardous cargo— meets contractual, DOT CFR 49, and security requirements while supporting timely delivery to our customers. What You Will Be Doing As the Packaging & Shipping Engineer you will be the program’s primary point of contact for all packaging and transportation needs. You’ll work side by side with Integrated Product Teams (IPTs), suppliers, and the LM Shipping department to develop, qualify, and continuously improve packaging solutions that protect value critical hardware and comply with safety and classification rules. Your responsibilities will include: • Collaborating with IPTs, suppliers, and the shipping organization to define packaging and transport requirements for systems, subsystems, and components. •...

Description: You will be the Circuit Card Design Engineer – Microelectronics Packaging for Lockheed Martin’s Missiles & Fire Control division. Our team drives the definition, development, and validation of next generation microelectronics processes, tool flows, and design methodologies for multichip packages. By advancing organic, silicon, active silicon, embedded passive, and miniature inductor substrates, you help deliver the size weight power cost (SWAP C) reductions that keep our missile and fire control systems at the cutting edge. What You Will Be Doing As the Circuit Card Design Engineer you will translate high performance circuit card expertise into emerging substrate technologies, create detailed single BGA package designs, and build verification plans that meet stringent Design Assurance standards. You will partner with materials, mechanical, manufacturing, and test groups to ensure packaging solutions flow smoothly from concept to production. Your...

Description: You will be the ElectroMechanical Design Engineer for the Advanced Electronics Packaging team at Lockheed Martin Missiles & Fire Control. Our team pioneers 2 D/3 D heterogeneous packaging concepts, integrating thin film, semiconductor and high performance thermal management technologies to create next generation electronic systems for aerospace and defense missions. What You Will Be Doing As the ElectroMechanical Design Engineer you will design, prototype and test cutting edge packaging solutions while collaborating with electrical, systems, test and product design engineers. You will work side by side with Lockheed Martin’s senior Advanced Packaging SME, gaining hands on experience with emerging semiconductor manufacturing processes and translating them into flight qualified hardware. Your responsibilities will include: • Conceiving and modeling 2 D/3 D heterogeneous package architectures that meet size, weight, power and reliability targets. • Developing...