SAIC
IN
Description SAIC is seeking a talented and motivated Advanced Packaging Engineer to support cutting-edge missile system hardware design and analysis efforts. In this role, you will collaborate with multidisciplinary engineering teams to develop, analyze, and validate advanced microelectronics packaging solutions for complex defense systems. This position offers a hybrid work schedule; however, candidates must reside within commuting distance of Crane, IN. JOB RESPONSIBILITES: Support mechanical design and analysis of missile system hardware and microelectronics packaging and assembly Perform mechanical modeling and simulation activities, including finite element analysis (FEA), thermal fatigue, shock and vibration analysis, and MATLAB-based modeling Apply systems engineering principles throughout all stages of the product lifecycle, including requirement development, verification, and validation Participate in and support Systems Engineering Technical Reviews,...