Lockheed Martin
Chelmsford, MA, USA
Description: You will be the Microelectronics Wire Bonder for the Fabrication Team. Our team is responsible for producing high‑precision hybrid microcircuits and sub‑assemblies that enable advanced electronic systems. What You Will Be Doing As the Microelectronics Wire Bonder your responsibilities will include, but are not limited to: Performs fabrication or modification tasks on hybrid microcircuits and sub-assemblies. Performs fabrication of hybrid microcircuits; e.g., aluminum and gold wirebonding under conditions such as small pad sizes down to .001 inch squares, very high semiconductor chip density, unusual substrate configurations which require special setup and bonding techniques. Screen defective hybrids by visual or mechanical testing, wirebonds or chip placement. Perform final assembly operations such as attachment of feedthrough pins, soldering of coils, and mounting of substrates in special non-standard packages. Why Join Us We are...