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3 electromechanical packaging engineer iii jobs found

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United States electromechanical packaging engineer iii
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Lockheed Martin
Jun 02, 2026
ElectroMechanical Packaging Engineer III
Lockheed Martin Cape Canaveral, FL
Description: Join us at Lockheed Martin as an Electro-Mechanical Packaging Engineer where you will have responsibilities for electronics packaging development including mechanical design, stress and thermal analysis, an electronics and mechanical CAD (drawing development and release). Location: This position does not support teleworking ;the selected candidate will be located near our Lockheed Martin Space facility in either: • Englewood CO (Relocation assistance available) • Cape Canaveral FL (*No relocation assistance for this location) You are expected to work a flexible 9x80 schedule in the office full-time. What does this role look like? As an Electro-Mechanical Packaging Engineer within the Fleet Ballistic Missile (FBM) Avionics team, you will be the technical lead for all Electro-Mechanical items within the Avionics Portfolio. Tasks include: • Sustaining the current deployed weapon system ensuring continued credibility and availability of our nation’s...
Lockheed Martin
Apr 10, 2026
ElectroMechanical Packaging Engineer III
Lockheed Martin Englewood, CO
Description: The Fleet Ballistic Missile Avionics team is seeking an experienced Electronics Packaging Engineer who will work closely with senior engineers to develop preliminary 3D concept models of space flight avionics hardware and ultimately advance them for flight use. Location: This position does not support teleworking ; you will be located near our Lockheed Martin Space facility in: Littleton or Englewood CO and be expected to work a flexible 9x80 schedule in the office full-time. What does this role look like? • Support trade studies on electronic enclosure design approaches and will provide technical data for informal and formal design review documentation and presentations. • Coordinate with thermal, dynamic, stress, reliability, EMC, and survivability analyses to assure compliant designs. You will support manufacturing and test disciplines in minimizing cycle time and resolving electronic packaging problems. • Establish specifications for contract...
Lockheed Martin
May 02, 2026
ElectroMechanical Packaging Engineer II
Lockheed Martin Englewood, CO
Description: The Fleet Ballistic Missile Avionics team is seeking an experienced Electronics Packaging Engineer who will work closely with senior engineers to develop preliminary 3D concept models of space flight avionics hardware and ultimately advance them for flight use. Location: This position does not support teleworking ; you will be located near our Lockheed Martin Space facility in: Littleton or Englewood CO and be expected to work a flexible 9x80 schedule in the office full-time. What does this role look like? • Support trade studies on electronic enclosure design approaches and will provide technical data for informal and formal design review documentation and presentations. • You will coordinate with thermal, dynamic, stress, reliability, EMC, and survivability analyses to assure compliant designs. You will support manufacturing and test disciplines in minimizing cycle time and resolving electronic packaging problems. • You will establish specifications for...
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