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6 electromechanical packaging engineer iii jobs found

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electromechanical packaging engineer iii
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Lockheed Martin
Feb 26, 2026
ElectroMechanical Packaging Engineer III
Lockheed Martin Englewood, CO, USA
Description: Join us at Lockheed Martin as an Electronics Packaging Engineer for the D5 Life Extension II program for avionics enclosure design and analysis. Location: This position does not support teleworking ;the selected candidate will be located near our Lockheed Martin Space facility in: Littleton or Englewood CO and be expected to work a flexible 9x80 schedule in the office full-time. Key activities you will accomplish in this role: • Electronics packaging engineer for space flight applications, Geometric Dimensioning and Tolerancing (GD&T) and CREO and/or Pro-E CAD design. • Create 3D solid models in CREO of space flight avionics and power hardware. • Perform electronic packaging design and provide technical data for informal and formal Design Review documentation and presentations. • Coordinate with thermal, dynamic, stress, reliability, EMC, and survivability analyses to assure compliant designs. • Support manufacturing and test disciplines in...
Lockheed Martin
Feb 19, 2026
ElectroMechanical Packaging Engineer III
Lockheed Martin Englewood, CO, USA
Description: Join us at Lockheed Martin as an Electronics Packaging Engineer for the D5 Life Extension II program for avionics enclosure design and analysis. Location: This position does not support teleworking ;the selected candidate will be located near our Lockheed Martin Space facility in: Littleton or Englewood CO and be expected to work a flexible 9x80 schedule in the office full-time. Key activities you will accomplish in this role: • Electronics packaging engineer for space flight applications, Geometric Dimensioning and Tolerancing (GD&T) and CREO and/or Pro-E CAD design. • Create 3D solid models in CREO of space flight avionics and power hardware. • Perform electronic packaging design and provide technical data for informal and formal Design Review documentation and presentations. • Coordinate with thermal, dynamic, stress, reliability, EMC, and survivability analyses to assure compliant designs. • Support manufacturing and test disciplines in...
Lockheed Martin
Feb 19, 2026
ElectroMechanical Packaging Engineer III
Lockheed Martin Englewood, CO, USA
Description: Join us at Lockheed Martin as an Electronics Packaging Engineer for the D5 Life Extension II program for avionics enclosure design and analysis. Location: This position does not support teleworking ;the selected candidate will be located near our Lockheed Martin Space facility in: Littleton or Englewood CO and be expected to work a flexible 9x80 schedule in the office full-time. Key activities you will accomplish in this role: • Electronics packaging engineer for space flight applications, Geometric Dimensioning and Tolerancing (GD&T) and CREO and/or Pro-E CAD design. • Create 3D solid models in CREO of space flight avionics and power hardware. • Perform electronic packaging design and provide technical data for informal and formal Design Review documentation and presentations. • Coordinate with thermal, dynamic, stress, reliability, EMC, and survivability analyses to assure compliant designs. • Support manufacturing and test disciplines in...
Lockheed Martin
Feb 19, 2026
ElectroMechanical Packaging Engineer III
Lockheed Martin Englewood, CO, USA
Description: Join us at Lockheed Martin as an Electronics Packaging Engineer for the D5 Life Extension II program for avionics enclosure design and analysis. Location: This position does not support teleworking ;the selected candidate will be located near our Lockheed Martin Space facility in: Littleton or Englewood CO and be expected to work a flexible 9x80 schedule in the office full-time. Key activities you will accomplish in this role: • Electronics packaging engineer for space flight applications, Geometric Dimensioning and Tolerancing (GD&T) and CREO and/or Pro-E CAD design. • Create 3D solid models in CREO of space flight avionics and power hardware. • Perform electronic packaging design and provide technical data for informal and formal Design Review documentation and presentations. • Coordinate with thermal, dynamic, stress, reliability, EMC, and survivability analyses to assure compliant designs. • Support manufacturing and test disciplines in...
Lockheed Martin
Feb 19, 2026
ElectroMechanical Packaging Engineer II
Lockheed Martin Englewood, CO, USA
Description: The Fleet Ballistic Missile Avionics team is seeking an experienced Electronics Packaging Engineer who will work closely with senior engineers to develop preliminary 3D concept models of space flight avionics hardware and ultimately advance them for flight use. Location: This position does not support teleworking ; you will be located near our Lockheed Martin Space facility in: Littleton or Englewood CO and be expected to work a flexible 9x80 schedule in the office full-time. What does this role look like? • Support trade studies on electronic enclosure design approaches and will provide technical data for informal and formal design review documentation and presentations. • You will coordinate with thermal, dynamic, stress, reliability, EMC, and survivability analyses to assure compliant designs. You will support manufacturing and test disciplines in minimizing cycle time and resolving electronic packaging problems. • You will establish specifications for...
Lockheed Martin
Feb 19, 2026
ElectroMechanical Packaging Engineer II
Lockheed Martin Englewood, CO, USA
Description: The Fleet Ballistic Missile Avionics team is seeking an experienced Electronics Packaging Engineer who will work closely with senior engineers to develop preliminary 3D concept models of space flight avionics hardware and ultimately advance them for flight use. Location: This position does not support teleworking ; you will be located near our Lockheed Martin Space facility in: Littleton or Englewood CO and be expected to work a flexible 9x80 schedule in the office full-time. What does this role look like? • Support trade studies on electronic enclosure design approaches and will provide technical data for informal and formal design review documentation and presentations. • Coordinate with thermal, dynamic, stress, reliability, EMC, and survivability analyses to assure compliant designs. • Support manufacturing and test disciplines in minimizing cycle time and resolving problems. • Establish specifications for contract assemblers and raw-material vendors....
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